Latest News

Micron Upgrades DDR5, LPDDR5X and UFS Storage, Improving Performance and Energy Efficiency

2025-03-09
On February 25, 2025, Micron announced the world's first 1γ (1-gamma) DDR5 samples, bringing 1γ technology to market first, further demonstrating Micron's leadership in technology and manufacturing. As the industry's first to provide 1γ (1-gamma) to ecosystem partners and select customers

Storage Giants Plan to Discontinue DDR3, DDR4 Production

2025-03-03
According to DIGITIMES, as DRAM prices are falling due to weak demand, the three major DRAM manufacturers—Samsung Electronics, SK Hynix, and Micron—intend to concentrate production resources on DDR5 and High Bandwidth Memory (HBM), leading to plans to discontinue DDR3 and DDR4 production within 2025.

Rise of Domestic Storage Chips! Self-sufficiency Rate to Reach 50% Within 2 Years?

2025-03-04
What is "new infrastructure"? Recently, the storage chip industry has been bustling with activity. The three Korean storage giants—Samsung, SK Hynix, and Micron—have made a decision: they plan to discontinue DDR4 production within the year, focusing entirely on DDR5 and HBM production.

Yangtze Memory's Hybrid Bonding Technology Helps Samsung Break Through 400-Layer NAND Stacking Bottleneck

2025-02-25
According to Korean media ZDNet Korea, Samsung Electronics recently reached a patent licensing agreement with Yangtze Memory Technologies for "Hybrid Bonding" technology for 3D NAND. Starting with the 10th generation V-NAND (V10), Samsung will adopt Yangtze Memory's patented technology for production.